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? 2009-2014 microchip technology inc. ds20002166b-page 1 re46c100 features: low quiescent current (< 100 na) low driver r on C 20 ?? typical at 9v wide operating voltage range available in 8-pin dfn, pdip and soic packages general description: the re46c100 devices are intended for applications using a self oscillating piezoelectric horn, although it can be used in direct drive applications. feedback control and a driver circuit are provided, as well as a horn enable function. the re46c100 is intended for use in smoke detectors, co detectors, personal security products and electronic toys. package types functional block diagram hrnen 5 6 7 8 hornsv ss hornb 12 3 4 ncnc feed v dd re46c100 pdip, soic re46c100 2x3 dfn* * includes exposed thermal pad (ep); see ta b l e 2 - 1 . nc v dd feed horns hornb 1 2 3 4 8 7 6 5 v ss hrnen nc ep 9 8 2 5 6 4 7 hrnen v dd v ss feed horns hornb piezoelectric horn driver circuit downloaded from: http:///
re46c100 ds20002166b-page 2 ? 2009-2014 microchip technology inc. typical application 12 3 4 8 76 5 re46c100 horn enable active high 9v battery +- c2 (1) 1 f r3 1.5 m r4 220 k c1 0.001 f note 1: place c2 close to the device power pins to minimize horn switching noise. downloaded from: http:///
? 2009-2014 microchip technology inc. ds20002166b-page 3 re46c100 1.0 electrical characteristics absolute maximum ratings? supply voltage............................................. ................. v dd =18v input voltage range except feed, test ....... v in = -0.3v to v dd +0.3v feed input voltage range ........................... v infd =-10 to +22v input current except feed ......................................... i in =10ma operating temperature......................................t a = -40 to +85c storage temperature ...................................t stg = -55 to +125c maximum junction temperature ............................... t j = +150c ? notice: stresses above those listed under maximum ratings may cause permanent damage to the device. this is a stress rating only and functional operation of the device at these or any other conditions above those indicated in the operation listings of this specification is not implied. exposure to maximum rating conditions for extended periods may affect device reliability. dc electrical characteristics dc electrical characteristics: unless otherwise indicated, all parameters apply at t a =+25c, v dd =9v, typical application. parameter symbol test pin min. typ. max. units conditions supply voltage v dd 26 9 1 6v o p e r a t i n g supply current i dd1 2 100 na hrnen = 0v, feed = 0v input voltage low v il1 8 1 v input voltage high v ih1 82 . 3 v input leakage low i il1 8 - 1 0 0n a v in =v ss i lfd 4 -50 a feed = -10v input leakage high i ih1 8 100 na v in =v dd i hfd 4 5 0 a f e e d = 2 2 v output voltage low v ol1 6, 7 0.3 0.5 v i ol =16ma v ol2 6, 7 0.9 v i ol =16ma, v dd =7.2v output voltage high v oh1 6, 7 8.5 8.7 v i oh =-16ma v oh2 6, 7 6.3 v i oh =-16ma, v dd =7.2v temperature specifications electrical specifications: unless otherwise indicated, all parameters apply at t a =+25c, v dd =9v, typical application. parameters sym. min. typ. max. units conditions temperature ranges operating temperature range t a -40 +85 c storage temperature range t stg -55 +125 c thermal package resistances thermal resistance, 8l 2x3 dfn ja 7 5 c / w thermal resistance, 8l-pdip ja 89.3 c/w thermal resistance, 8l-soic ja 149.5 c/w downloaded from: http:///
re46c100 ds20002166b-page 4 ? 2009-2014 microchip technology inc. 2.0 pin descriptions the descriptions of the pins are listed in tab l e 2 - 1 . table 2-1: pin function table re46c100 pdip, soic re46c100 dfn symbol description 1 1 nc no connection 22v dd connect to the positive supply voltage 3 3 nc no connection 4 4 feed usually connected to the feedback electrode through a current-limiting resistor. if not used, this pin must be connected to v dd or v ss . 55v ss connect to the negative supply voltage 6 6 hornb this pin is connected to the metal electrode of a piezoelectric transducer. 7 7 horns this pin is a complementary output to hornb, connected to the ceramic electrode of the piezoelectric transducer. 8 8 hrnen this pin enables the horn with a logic high. 9 ep exposed thermal pad. this pad should be connected to v ss . downloaded from: http:///
? 2009-2014 microchip technology inc. ds20002166b-page 5 re46c100 3.0 device description the re46c100 horn driver provides the circuitry necessary to drive a three-terminal self-oscillating piezoelectric horn. it can also drive a two-terminal piezoelectric horn with the feed pin used as a signal input. the horn driver provides a push-pull circuit to drive the horn, as shown in the typical application circuit. in a self-oscillating application, the feed pin is connected to the feedback pin of the piezoelectric horn through a resistor. to drive a two-terminal piezoelectric horn with an external signal, the feed pin should be used as the external signal input. the horn is enabled when hrnen is driven to a logic high and is silenced when hrnen is driven to a logic low. the horn output can be modulated using the hrnen input. downloaded from: http:///
re46c100 ds20002166b-page 6 ? 2009-2014 microchip technology inc. 4.0 packaging information 4.1 package marking information xxxxxxxxxxxxxnnn yyww 8-lead dfn (2x3x0.9 mm) example adg 420 25 8-lead pdip (300 mil) example re46c100 i/p^^^256 1420 legend: xx...x customer-specific information y year code (last digit of calendar year) yy year code (last 2 digits of calendar year) ww week code (week of january 1 is week 01) nnn alphanumeric traceability code pb-free jedec designator for matte tin (sn) * this package is pb-free. the pb-free jedec designator ( ) can be found on the outer packaging for this package. note : in the event the full microchip part number cannot be marked on one line, it will be carried over to the next line, thus limiting the number of available characters for customer-specific information. 3 e 3 e 3 e 8-lead soic (3.90 mm) example nnn 46c100i sn^^^1420 256 3 e downloaded from: http:///
? 2009-2014 microchip technology inc. ds20002166b-page 7 re46c100 d n e note 1 1 2 exposed pad note 1 2 1 d2 k l e2 n e b a3 a1 a note 2 bottom view top view downloaded from: http:///
re46c100 ds20002166b-page 8 ? 2009-2014 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
? 2009-2014 microchip technology inc. ds20002166b-page 9 re46c100 b a for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging note: microchip technology drawing no. c04-018d sheet 1 of 2 8-lead plastic dual in-line (p) - 300 mil body [pdip] eb e a a1 a2 l 8x b 8x b1 d e1 c c plane .010 c 12 n note 1 top view end view side view e downloaded from: http:///
re46c100 ds20002166b-page 10 ? 2009-2014 microchip technology inc. microchip technology drawing no. c04-018d sheet 2 of 2 for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging note: 8-lead plastic dual in-line (p) - 300 mil body [pdip] units inches dimension limits min nom max number of pins n 8 pitch e .100 bsc top to seating plane a - - .210 molded package thickness a2 .115 .130 .195 base to seating plane a1 .015 shoulder to shoulder width e .290 .310 .325 molded package width e1 .240 .250 .280 overall length d .348 .365 .400 tip to seating plane l .115 .130 .150 lead thickness c .008 .010 .015 upper lead width b1 .040 .060 .070 lower lead width b .014 .018 .022 overall row spacing eb - - .430 bsc: basic dimension. theoretically exact value shown without tolerances. 3. 1. protrusions shall not exceed .010" per side. 2.4. noes: -- dimensions d and e1 do not include mold flash or protrusions. mold flash or pin 1 visual index feature may vary, but must be located within the hatched area. significant characteristic dimensioning and tolerancing per asme y14.5m e datum a datum a e b e 2 b e 2 alternate lead design (vendor dependent) downloaded from: http:///
? 2009-2014 microchip technology inc. ds20002166b-page 11 re46c100 note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
re46c100 ds20002166b-page 12 ? 2009-2014 microchip technology inc. note: for the most current package drawings, please see the microchip packaging specification located at http://www.microchip.com/packaging downloaded from: http:///
? 2009-2014 microchip technology inc. ds20002166b-page 13 re46c100 downloaded from: http:///
re46c100 ds20002166b-page 14 ? 2009-2014 microchip technology inc. notes: downloaded from: http:///
? 2009-2014 microchip technology inc. ds20002166b-page 15 re46c100 appendix a: revision history revision b (june 2014) the following is the list of modifications: 1. added new package to the family (2x3 dfn) and related information throughout the document. 2. added thermal package resistance information in temperature specifications . 3. added package markings and drawings for all packages. 4. added product identification system . revision a (may 2009) original release of this document. downloaded from: http:///
? 2009-2014 microchip technology inc. ds20002166b-page 16 re46c100 product identification system to order or obtain information, e. g., on pricing or delivery, refer to the factory or the listed sales office . device: re46c100: cmos photoelectric smoke detector asic re46c100t: cmos photoelectric smoke detector asic (tape and reel) package: d = 8-lead dfn e = plastic dual in-line (300 mil body), 8-lead (pdip) s = plastic small outline - narrow, 3.90 mm body, 8-lead (soic) examples: a) re46c100d8f: 8ld dfn package, lead free b) re46c100d8tf: 8ld dfn package, tape and reel, lead free c) re46c100e8f: 8ld pdip package, lead free d) re46c100s8f: 8ld soic package, lead free e) RE46C100S8TF: 8ld soic package, tape and reel, lead free part no. x device xx number of pins t tape and reel free x lead package downloaded from: http:///
? 2009-2014 microchip technology inc. ds20002166b-page 17 information contained in this publication regarding device applications and the like is provided only for your convenience and may be superseded by updates. it is your responsibility to ensure that your application meets with your specifications. microchip makes no representations or warranties of any kind whether express or implied, written or oral, statutory or otherwise, related to the information, including but not limited to its condition, quality, performance, merchantability or fitness for purpose . microchip disclaims all liability arising from this information and its use. use of microchip devices in life support and/or safety applications is entirely at the buyers risk, and the buyer agrees to defend, indemnify and hold harmless microchip from any and all damages, claims, suits, or expenses resulting from such use. no licenses are conveyed, implicitly or otherwise, under any microchip intellectual property rights. trademarks the microchip name and logo, the microchip logo, dspic, flashflex, k ee l oq , k ee l oq logo, mplab, pic, picmicro, picstart, pic 32 logo, rfpic, sst, sst logo, superflash and uni/o are registered trademarks of microchip technology incorporated in the u.s.a. and other countries. filterlab, hampshire, hi-tech c, linear active thermistor, mtp, seeval and the embedded control solutions company are registered trademarks of microchip technology incorporated in the u.s.a. silicon storage technology is a registered trademark of microchip technology inc. in other countries. analog-for-the-digital age, app lication maestro, bodycom, chipkit, chipkit logo, codeguard, dspicdem, dspicdem.net, dspicworks, dsspeak, ecan, economonitor, fansense, hi-tide, in-circuit serial programming, icsp, mindi, miwi, mpasm, mpf, mplab certified logo, mplib, mplink, mtouch, omniscient code generation, picc, picc-18, picdem, picdem.net, pickit, pictail, real ice, rflab, select mode, sqi, serial quad i/o, total endurance, tsharc, uniwindriver, wiperlock, zena and z-scale are trademarks of microchip technology incorporated in the u.s.a. and other countries. sqtp is a service mark of microchip technology incorporated in the u.s.a. gestic and ulpp are registered trademarks of microchip technology germany ii gmbh & co. kg, a subsidiary of microchip technology inc., in other countries. all other trademarks mentioned herein are property of their respective companies. ? 2009-2014, microchip technology incorporated, printed in the u.s.a., all rights reserved. printed on recycled paper. isbn: 978-1-63276-287-0 note the following details of the code protection feature on microchip devices: microchip products meet the specification cont ained in their particular microchip data sheet. microchip believes that its family of products is one of the most secure families of its kind on the market today, when used i n the intended manner and under normal conditions. there are dishonest and possibly illegal methods used to breach the code protection feature. all of these methods, to our knowledge, require using the microchip products in a manner outside the operating specif ications contained in microchips data sheets. most likely, the person doing so is engaged in theft of intellectual property. microchip is willing to work with the customer who is concerned about the integrity of their code. neither microchip nor any other semiconduc tor manufacturer can guarantee the security of their code. code protection does not mean that we are guaranteeing the product as unbreakable. code protection is constantly evolving. we at microchip are co mmitted to continuously improvin g the code protection features of our products. attempts to break microchips code protection feature may be a violation of the digital millennium copyright act. if such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that act. microchip received iso/ts-16949:2009 certification for its worldwide headquarters, design and wafer fabrication facilities in chandler and tempe, arizona; gresham, oregon and design centers in california and india. the company?s quality system processes and procedures are for its pic ? mcus and dspic ? dscs, k ee l oq ? code hopping devices, serial eeproms, microperipherals, nonvolatile memory an d analog products. in addition, microchip?s quality system for the design and manufacture of development systems is iso 9001:2000 certified. quality management s ystem certified by dnv == iso/ts 16949 == downloaded from: http:///
ds20002166b-page 18 ? 2009-2014 microchip technology inc. americas corporate office 2355 west chandler blvd. chandler, az 85224-6199 tel: 480-792-7200 fax: 480-792-7277 technical support: http://www.microchip.com/ support web address: www.microchip.com atlanta duluth, ga tel: 678-957-9614 fax: 678-957-1455 austin, tx tel: 512-257-3370 boston westborough, ma tel: 774-760-0087 fax: 774-760-0088 chicago itasca, il tel: 630-285-0071 fax: 630-285-0075 cleveland independence, oh tel: 216-447-0464 fax: 216-447-0643 dallas addison, tx tel: 972-818-7423 fax: 972-818-2924 detroit novi, mi tel: 248-848-4000 houston, tx tel: 281-894-5983 indianapolis noblesville, in tel: 317-773-8323 fax: 317-773-5453 los angeles mission viejo, ca tel: 949-462-9523 fax: 949-462-9608 new york, ny tel: 631-435-6000 san jose, ca tel: 408-735-9110 canada - toronto tel: 905-673-0699 fax: 905-673-6509 asia/pacific asia pacific office suites 3707-14, 37th floor tower 6, the gateway harbour city, kowloon hong kong tel: 852-2943-5100 fax: 852-2401-3431 australia - sydney tel: 61-2-9868-6733 fax: 61-2-9868-6755 china - beijing tel: 86-10-8569-7000 fax: 86-10-8528-2104 china - chengdu tel: 86-28-8665-5511 fax: 86-28-8665-7889 china - chongqing tel: 86-23-8980-9588 fax: 86-23-8980-9500 china - hangzhou tel: 86-571-8792-8115 fax: 86-571-8792-8116 china - hong kong sar tel: 852-2943-5100 fax: 852-2401-3431 china - nanjing tel: 86-25-8473-2460 fax: 86-25-8473-2470 china - qingdao tel: 86-532-8502-7355 fax: 86-532-8502-7205 china - shanghai tel: 86-21-5407-5533 fax: 86-21-5407-5066 china - shenyang tel: 86-24-2334-2829 fax: 86-24-2334-2393 china - shenzhen tel: 86-755-8864-2200 fax: 86-755-8203-1760 china - wuhan tel: 86-27-5980-5300 fax: 86-27-5980-5118 china - xian tel: 86-29-8833-7252 fax: 86-29-8833-7256 china - xiamen tel: 86-592-2388138 fax: 86-592-2388130 china - zhuhai tel: 86-756-3210040 fax: 86-756-3210049 asia/pacific india - bangalore tel: 91-80-3090-4444 fax: 91-80-3090-4123 india - new delhi tel: 91-11-4160-8631 fax: 91-11-4160-8632 india - pune tel: 91-20-3019-1500 japan - osaka tel: 81-6-6152-7160 fax: 81-6-6152-9310 japan - tokyo tel: 81-3-6880- 3770 fax: 81-3-6880-3771 korea - daegu tel: 82-53-744-4301 fax: 82-53-744-4302 korea - seoul tel: 82-2-554-7200 fax: 82-2-558-5932 or 82-2-558-5934 malaysia - kuala lumpur tel: 60-3-6201-9857 fax: 60-3-6201-9859 malaysia - penang tel: 60-4-227-8870 fax: 60-4-227-4068 philippines - manila tel: 63-2-634-9065 fax: 63-2-634-9069 singapore tel: 65-6334-8870 fax: 65-6334-8850 taiwan - hsin chu tel: 886-3-5778-366 fax: 886-3-5770-955 taiwan - kaohsiung tel: 886-7-213-7830 taiwan - taipei tel: 886-2-2508-8600 fax: 886-2-2508-0102 thailand - bangkok tel: 66-2-694-1351 fax: 66-2-694-1350 europe austria - wels tel: 43-7242-2244-39 fax: 43-7242-2244-393 denmark - copenhagen tel: 45-4450-2828 fax: 45-4485-2829 france - paris tel: 33-1-69-53-63-20 fax: 33-1-69-30-90-79 germany - dusseldorf tel: 49-2129-3766400 germany - munich tel: 49-89-627-144-0 fax: 49-89-627-144-44 germany - pforzheim tel: 49-7231-424750 italy - milan tel: 39-0331-742611 fax: 39-0331-466781 italy - venice tel: 39-049-7625286 netherlands - drunen tel: 31-416-690399 fax: 31-416-690340 poland - warsaw tel: 48-22-3325737 spain - madrid tel: 34-91-708-08-90 fax: 34-91-708-08-91 sweden - stockholm tel: 46-8-5090-4654 uk - wokingham tel: 44-118-921-5800 fax: 44-118-921-5820 worldwide sales and service 03/25/14 downloaded from: http:///

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